LeEco Le 2

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Released

2016, April. Released 2016, April

Chipset

Mediatek MT6797 Helio X20 (20 nm)Qualcomm MSM8976 Snapdragon 652 (28 nm)

Camera

Single

Single

Display

5.5 inches, 83.4 cm2 (~74.4% screen-to-body ratio)

1080 x 1920 pixels, 16:9 ratio (~401 ppi density)

IPS LCD

Storage

32GB 3GB RAM, 64GB 3GB RAM

Battery

Li-Ion 3000 mAh, non-removable

RAM

Description

LeEco Le 2 released on 2016, April. It has the Mediatek MT6797 Helio X20 (20 nm)Qualcomm MSM8976 Snapdragon 652 (28 nm) chipset, Mali-T880 MP4Adreno 510, 32GB 3GB RAM, 64GB 3GB RAM with Li-Ion 3000 mAh, non-removable battery.

Specifications

hardware

Chipset (SOC)

Mediatek MT6797 Helio X20 (20 nm)Qualcomm MSM8976 Snapdragon 652 (28 nm)

CPU

Deca-core (2x2.3 GHz Cortex-A72, 4x2 GHz Cortex-A53, 4x1.4 GHz Cortex-A53)Octa-core (4x1.4 GHz Cortex-A53 & 4x1.8 GHz Cortex-A72)

GPU

Mali-T880 MP4Adreno 510

display

Display size

5.5 inches, 83.4 cm2 (~74.4% screen-to-body ratio)

Resolution

1080 x 1920 pixels, 16:9 ratio (~401 ppi density)

Screen Technology

IPS LCD

camera

Rear camera

Single

Rear Features

Dual-LED dual-tone flash, panorama, HDR

First rear camera(wide)

16 MP, f/2.0, PDAF

Front camera

Single

Video Recording Resolution

Rear: 4K@30fps, 1080p@30fps, 720p@120fps

Front: 1080p@30fps

memory & storage

RAM Size

32GB 3GB RAM, 64GB 3GB RAM

External storage Expansion

No

body

Dimension

151.1 x 74.2 x 7.5 mm (5.95 x 2.92 x 0.30 in)

Weight

153 g (5.40 oz)

Battery

Capacity

Li-Ion 3000 mAh, non-removable

Charging

18W wired, QC2, 50% in 30 min (advertised)

Network

Cellular Technology

GSM / HSPA / LTE

Sim support

Dual SIM (Nano-SIM, dual stand-by)

Connectivity

USB Interface (Connector)

USB Type-C

Location Technology

GPS

GLONASS

BDS

Earjack

No

Wi-Fi

Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct

Wi-Fi Direct

Yes

Bluetooth

4.1, A2DP, LE

sensors

Fingerprint (rear-mounted)

accelerometer

gyro

proximity

compass

OS

Type

Android 6.0, EUI 5.6

Audio & video

Silicon Voyage

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