Intel Xeon D-2779
Intel
Summary
Cores
16
P-Cores
16
Threads
32
Base Clock
2.50 GHz
Boost Clock
3.40 GHz
Socket
FCBGA2579
Description
Specifications
General Specifications
Name
Intel Xeon D-2779
Plaform
Server
Family
Intel xeon series
Code Name
Ice Lake
Socket
FCBGA2579
Lithography
10 nm
# of CPU cores
16
P-cores: 16
# of Threads
32
L1 Cache
25 MB
Package size
52.5 mm x 45 mm
Instruction Set
64-bit
memory
Max Memory Size
1 TB
Memory Support
DDR4
# of Memory Channels
4
ECC Memory Support
No
graphics
Processor Graphics
No
connectivity
PCI Express
4.0
Max # of PCIe Lanes
32
other
Processor Base Frequency
2.50 GHz
Max # of UPI Links
0
TDP
126 W
Marketing Status
Launched
Embedded Options Available
No
Product Brief
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Maximum Memory Speed
3200 MHz
Intel Optane Persistent Memory Supported
No
Scalability
1S Only
Microprocessor PCIe Revision
Gen 4
Chipset / PCH PCIe Revision
Gen 3
# of USB Ports
4
USB Revision
3.0
Integrated LAN
No
Max # of SATA 6.0 Gb/s Ports
24
Intel Deep Learning Boost (Intel DL Boost)
Yes
Intel Resource Director Technology (Intel RDT)
Yes
Intel Optane Memory Supported
No
Intel Turbo Boost Technology
2.0
Intel Hyper-Threading Technology
Yes
Intel 64
Yes
Instruction Set Extensions
Intel® AVX-512
# of AVX-512 FMA Units
1
Enhanced Intel SpeedStep Technology
Yes
Thermal Monitoring Technologies
Yes
Integrated Intel QuickAssist Technology
No
Intel Volume Management Device (VMD)
Yes
Intel QuickAssist Software Acceleration
No
Intel Total Memory Encryption
Yes
Intel AES New Instructions
Yes
Intel Software Guard Extensions (Intel SGX)
Yes with Intel® SPS
Intel Trusted Execution Technology
Yes
Execute Disable Bit
Yes
Intel Boot Guard
Yes
Intel Platform Firmware Resilience Support
Yes
Default Maximum Enclave Page Cache (EPC) Size for Intel SGX
64 GB
Intel Crypto Acceleration
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel Virtualization Technology for Directed I/O (VT-d)
Yes